At PACK EXPO Las Vegas 2021, Honeywell Robotics demonstrated its intelligent, flexible depalletizer system featuring artificial intelligence, and 2D and 3D vision for pick-and-place depalletizing operations.
David Greenfield, editor in chief | Editor in Chief
David Greenfield joined Automation World in June 2011. Bringing a wealth of industry knowledge and media experience to his position, David’s contributions can be found in AW’s print and online editions and custom projects. Earlier in his career, David was Editorial Director of Design News at UBM Electronics, and prior to joining UBM, he was Editorial Director of Control Engineering at Reed Business Information, where he also worked on Manufacturing Business Technology as Publisher.
