Six PACK EXPO Scholarship recipients were recognized at the annual PACK gives BACK™ networking reception, sponsored by Rockwell Automation, at PACK EXPO Las Vegas and co-located Healthcare Packaging EXPO (Sept. 23-35, 2019; Las Vegas Convention Center). The PMMI Foundation awards these $5,000 scholarships annually to six students from PMMI Education Partner schools, according to show producer, PMMI, The Association for Packaging and Processing Technologies.
“These scholarships display PMMI’s continued investment in the next generation’s industry leaders,” says Jim Pittas, president and CEO, PMMI. “PMMI washonored to recognize these outstanding students’ achievements in front of the industry during PACK gives BACK.”
To qualify for thePACK EXPOscholarship, students be enrolled at an Education Partner, major in engineering, packaging, processing, mechatronics or a related field andmust demonstrate a financial need.
2019 Winners of PACK EXPO Scholarships:
Gregory Keiderling –Community College of Allegheny CountyMajor: MechatronicsRyan Meffert – CalPolyMajor: Industrial Technology & PackagingDaemon Pierskalla –Alexandria Technical CollegeMajor: MechatronicsLucas Poche –Pennsylvania College of TechnologyMajor: Plastics and Polymer Engineering TechnologyMaleeha Sami –San Jose State UniversityMajor: PackagingAmy Terranova –RutgersMajor: Packaging EngineeringTo learn more about PMMI Foundation scholarships, visit pmmi.org/foundation.
