PackML World Tour Continues

March 31, 2011
The PackML World Tour is an initiative of the OMAC Packaging Workgroup in cooperation with the Packaging Machinery Manufacturers Institute to explain the real business benefits of adopting PackML. 
Unlike past initiatives where consumer goods companies' engineers tried to sell the benefits of PackML, this time the executives of packaging machinery companies are speaking out in an effort to drive industry-wide adoption.
The best way to get a sense for the tour is to see and hear it in the words of some of the executives who are participating. I invite you to spend a few minutes watching three videos. Click on your browser's back button after each video completes.
Jack Aguero, vice president of business development and marketing for Pro Mach Inc. and a PMMI board member, was the first to explain the business benefits of the PackML standard at the PackML World Tour press conference at PACK EXPO International 2010.
Luciano Sottile, CEO and President of ILAPAK Group provided a European machine builder's perspective on the use of PackML.
And Michael Senske, President and CEO of Pearson Packaging spoke to the issue of competitors working together in the best interest of the customers.
PackML was created over a period of years by leading end users, machinery builders and technology providers working through the Packaging Workgroup of the Organization for Machine Automation and Control. The results of this work have been published by the International Society of Automation (ISA) as Technical Report TR0088.00.02 in conjunction with the ANSI/ISA 88 series of batch standards.
The next opportunity to learn about PackML will be at the MAKE2PACK & CONNECT-AND-PACK WORKSHOP being held the day before the Packaging Automation Forum near O'Hare airport in Chicago on April 25th. The OMAC group will also be holding a briefing on opening day of Interpack in Dusseldorf.

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