Two new modules for the vendor’s PACSystems RX3i system are said to reduce downtime, provide high resolution for improved process control and high-performance sampling of data to improve throughput.
The isolated thermocouple analog input module and isolated resistive temperature device (RTD) module deliver channel-to-channel isolation for performance and hot-swap capability to reduce downtime. High-performance sampling of data provides increased throughput as it processes the critical sample information. The high resolution (11.5-16 bits) of data gives better process control. These modules provide increased performance and advanced diagnostics, taking advantage of the high performance RX3i PCI bus. For applications in which the RX3i is controlling process-based manufacturing, the thermocouple modules provide advanced temperature input capabilities for applications in which it is critical to the control.GE Fanuc Intelligent Platformswww.gefanuc.com508.698.7456
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