The First Annual Packaging Automation Forum, held May 24 near Chicago, was a resounding success. About 150 machinery builders, users and technology suppliers gathered at the event—sponsored by Automation World and Packaging World magazines—to hear 13 speakers from the industrial world talk about what they are doing to bring new success to manufacturing.
A technology supplier panel discussion included (left to right) Dan Throne, of Bosch Rexroth; John Kowal, of Elau; Graham Harris
The Forum speakers left no doubt that the future belongs to such concepts and techniques as modular software, industrial networks and information sharing. Based on their comments, packaging professionals had best acknowledge the growing reality that their realm is now an integral part of the manufacturing process.
Several speakers warned that automation engineers in both the processing and the packaging areas of the companies had best learn how to align their priorities with corporate ones in order to make themselves a vital part of business growth and profitability, and not be thought of as a liability to be endured until something better comes along.
Plans are already underway for a second annual Packaging Automation Forum in 2007.
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