CC-Link Partner Association: Distributed Modular I/O for CC-Link

Jan. 4, 2013
This new generation of distributed modular I/O can be used in a cost effective way to replace standard slice I/O and distributed I/O solutions.

The company offers a variety of distributed modular I/O IO-Link slave devices, including discrete inputs and outputs, analog input and output channels, valve manifold control, industrial RFID processors and heads, as well as specialty sensors for measurement, position or color detection. Utilizing the vendor neutral standard IO-Link (www.io-link.com), the master block can communicate with up to four slave devices and then send their combined data back to the controller over the CC-Link network. In lieu of a backplane, each slave device is connected to the CC-Link IO-Link master by an industry-standard M12 port, creating an IP67 connection. Slave devices can be easily distributed across the machine without the use of controls cabinets typically used in today's CC-Link network architectures.

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